Leading-edge core technology
2023-12-21
01
Toshiba develops Semiconductor design AI: It can compress a year's development process into a day
Toshiba announced that it has completed the research and development of AI that can support semiconductor design, which can shorten the design process from one week to one year to less than one day, and the efficiency is significantly improved, and it will be officially adopted before the end of March 2024 for the research and development of next-generation power semiconductors. (Science and Technology Board Daily)
02
DNP successfully develops 3nm EUV Shadow Mask
Japan DNP announced that it has developed a 3nm EUV micro shadow light mask, with a revenue target of 10 billion yen in 2030, and will also cooperate with imec and other partners in the future to promote the research and development of 2nm light masks. At present, the global energy production of 3nm chip manufacturers only TSMC and Samsung Electronics, but the two semiconductor factories are in-house (own production) light mask. (Businesswire)
03
Japanese semiconductor equipment manufacturer Disco has developed a new cutting machine and has begun to supply some customers
Semiconductor cutting equipment manufacturer DISCO has developed a new cutting machine for energy-efficient semiconductors for cars that is 10 times faster than in the past. It is reported that silicon carbide (SiC) as a semiconductor material power efficiency is very high, but the material is hard and difficult to process, the research and development of new equipment will establish a new generation of power semiconductor mass production technology, is expected to promote the popularity of pure electric vehicles. At present, Cisco has begun to supply to some customers, and will officially mass produce after increasing orders. (Science and Technology Board Daily)
